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Optical Transceivers · OSFP800-2LR4-A2
Customized 800GBASE 2 x LR4 OSFP IHS/Closed Finned Top 8 x 100G PAM4 1310nm 10km Dual Duplex LC/UPC SMF Transceiver Module
Customized 800GBASE 2 x LR4 OSFP IHS/Closed Finned Top 8 x 100G PAM4 1310nm 10km DOM Dual Duplex LC/UPC SMF Optical Transceiver Module, Product Specification:Part Number - OSFP800-2LR4-A2, Vendor Name - FS, Form Factor - Twin-port OSFP IHS/Closed Finned Top, Max. Data Rate - 850Gbps (8x 106.25Gbps), Wavelength - 1271nm, 1291nm, 1311nm and 1331nm, Max. Cable Distance - 10km
Net price · DE
€2.373,00
ex. VAT
In stock
5-year warranty · Netcore-backed
Customized 800GBASE 2x LR4 OSFP PAM4 Optical Transceiver Module (SMF, 1271nm, 1291nm, 1311nm and 1331nm, 10km, Dual Duplex LC/UPC, DOM, IHS/Closed Finned Top)
The 800GBASE 2x LR4 OSFP optical transceiver module is designed for 800GBASE network throughput up to 10km link lengths over OS2 single-mode fibre (SMF) via dual duplex LC/UPC connectors. This transceiver is compliant with IEEE 802.3ck, OSFP MSA and CMIS Rev 5.0 standards. The built-in digital diagnostics monitoring (DDM) allows access to real-time operating parametres.
The twin-port OSFP IHS/Closed Finned Top transceiver is used in air-cooled switches. Featured with low latency, low power, and reliability, it can link upward in spine-leaf architectures for switch-to-switch applications, downward for top-of-rack switch links to network adapters, and/or to BlueField-3 DPUs in compute servers and storage subsystems. It is the ideal solution for HPC computing, AI, and cloud data centres.
Note: "Finned-top" transceivers are now called "Integrated HeatSink" (IHS) as the cooling fins are integrated into the OSFP connector metal top. Commonly used in air-cooled switches. "Flat-top" transceivers are now called "Riding Heat Sink" (RHS) as the cooling fins ride on top of the network card or systems internal cages. This is used for both air-cooled and liquid-cooled applications for DGX, ConnectX-7, and BlueField-3 DPUS.
The twin-port OSFP IHS/Closed Finned Top transceiver is used in air-cooled switches. Featured with low latency, low power, and reliability, it can link upward in spine-leaf architectures for switch-to-switch applications, downward for top-of-rack switch links to network adapters, and/or to BlueField-3 DPUs in compute servers and storage subsystems. It is the ideal solution for HPC computing, AI, and cloud data centres.
Note: "Finned-top" transceivers are now called "Integrated HeatSink" (IHS) as the cooling fins are integrated into the OSFP connector metal top. Commonly used in air-cooled switches. "Flat-top" transceivers are now called "Riding Heat Sink" (RHS) as the cooling fins ride on top of the network card or systems internal cages. This is used for both air-cooled and liquid-cooled applications for DGX, ConnectX-7, and BlueField-3 DPUS.
Highlights
- 01Built-in Broadcom 7nm DSP Chip, Max. Power Consumption 18W
- 02Self-developed 53G EML Laser Chip to Ensure Production
- 03Parametre Tests for Superior Performance, Quality, and Reliability
- 04High-speed Connectivity Compliant to IEEE 802.3ck
- 05Hot Pluggable OSFP MSA Compliant
- 06Support 2x 400G Breakout for Higher Port Density
- 078x 106.25G PAM4 Retimed 2x 400GAUI-4 C2M Electrical Interface
- 08For Higher Bandwidth in Hyperscale Data Centers and Cloud Infrastructure
Specifications
26 fields| Part Number | OSFP800-2LR4-A2 |
| Vendor Name | FS |
| Form Factor | Twin-port OSFP IHS/Closed Finned Top |
| Max. Data Rate | 850Gbps (8x 106.25Gbps) |
| Wavelength | 1271nm, 1291nm, 1311nm and 1331nm |
| Max. Cable Distance | 10km |
| Connector | Dual Duplex LC/UPC |
| Media | SMF |
| Transmitter Type | EML |
| Receiver Type | Siphotonics PIN PD |
| TX Power | -2.7~5.1dBm |
| Minimum Receiver Power | -9dBm |
| Power Budget | 6.3dB |
| Receiver Overload | 5.1dBm |
| Max. Power Consumption | 18W |
| Extinction Ratio | >3.5dB |
| DDM/DOM | Supported |
| Commercial Temperature Range | 0 to 70°C (32 to 158°F) |
| Modulation (Electrical) | 8x 100G-PAM4 |
| Modulation (Optical) | Dual 4x 100G-PAM4 |
| CDR (Clock and Data Recovery) | TX & RX Built-in DSP |
| Inbuilt FEC | No |
| Packaging Technology | COB (Chip on Board) Packaging |
| Modulation Format | PAM4 |
| Protocols | OSFP MSA HW Rev 4.1, CMIS Rev 5.0, MSA- 2x400G-LR4-10, IEEE P802.3ck D3.0 |
| Warranty | 5 Years |
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